HEADSET INCLUDING IN-EAR MICROPHONE
A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface...
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| creator | KWON, Seyoun YOON, Kyeongcheol JEONG, Hyeonyeong PARK, Haekeu KIM, Seonmi CHO, Sunghoon LEE, Jeock |
| description | A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface and the second surface, a speaker seating portion formed by recessing by a specific depth from a first portion of the first surface toward the second surface, a space formed between the speaker seating portion and the second surface, a speaker hole penetrated from the speaker seating portion to the space, a microphone hole penetrated from a second portion of the first surface to the space, an acoustic hole formed by penetrating the second surface from the space, a speaker seated in the speaker seating portion, a first printed circuit board disposed on the second portion and having a via hole connected with the microphone hole, a second printed circuit board electrically connected with the first printed circuit board and a connection unit of the speaker, and a microphone mounted at a position aligned with the via hole on the first printed circuit board. Various other embodiments identified in this document are also possible. |
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Various other embodiments identified in this document are also possible.</description><language>eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; PUBLIC ADDRESS SYSTEMS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240125&DB=EPODOC&CC=US&NR=2024031727A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240125&DB=EPODOC&CC=US&NR=2024031727A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KWON, Seyoun</creatorcontrib><creatorcontrib>YOON, Kyeongcheol</creatorcontrib><creatorcontrib>JEONG, Hyeonyeong</creatorcontrib><creatorcontrib>PARK, Haekeu</creatorcontrib><creatorcontrib>KIM, Seonmi</creatorcontrib><creatorcontrib>CHO, Sunghoon</creatorcontrib><creatorcontrib>LEE, Jeock</creatorcontrib><title>HEADSET INCLUDING IN-EAR MICROPHONE</title><description>A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface and the second surface, a speaker seating portion formed by recessing by a specific depth from a first portion of the first surface toward the second surface, a space formed between the speaker seating portion and the second surface, a speaker hole penetrated from the speaker seating portion to the space, a microphone hole penetrated from a second portion of the first surface to the space, an acoustic hole formed by penetrating the second surface from the space, a speaker seated in the speaker seating portion, a first printed circuit board disposed on the second portion and having a via hole connected with the microphone hole, a second printed circuit board electrically connected with the first printed circuit board and a connection unit of the speaker, and a microphone mounted at a position aligned with the via hole on the first printed circuit board. Various other embodiments identified in this document are also possible.</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFD2cHV0CXYNUfD0c_YJdfH0cweydF0dgxR8PZ2D_AM8_P1ceRhY0xJzilN5oTQ3g7Kba4izh25qQX58anFBYnJqXmpJfGiwkYGRiYGxobmRuaOhMXGqANYXI4E</recordid><startdate>20240125</startdate><enddate>20240125</enddate><creator>KWON, Seyoun</creator><creator>YOON, Kyeongcheol</creator><creator>JEONG, Hyeonyeong</creator><creator>PARK, Haekeu</creator><creator>KIM, Seonmi</creator><creator>CHO, Sunghoon</creator><creator>LEE, Jeock</creator><scope>EVB</scope></search><sort><creationdate>20240125</creationdate><title>HEADSET INCLUDING IN-EAR MICROPHONE</title><author>KWON, Seyoun ; YOON, Kyeongcheol ; JEONG, Hyeonyeong ; PARK, Haekeu ; KIM, Seonmi ; CHO, Sunghoon ; LEE, Jeock</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024031727A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>KWON, Seyoun</creatorcontrib><creatorcontrib>YOON, Kyeongcheol</creatorcontrib><creatorcontrib>JEONG, Hyeonyeong</creatorcontrib><creatorcontrib>PARK, Haekeu</creatorcontrib><creatorcontrib>KIM, Seonmi</creatorcontrib><creatorcontrib>CHO, Sunghoon</creatorcontrib><creatorcontrib>LEE, Jeock</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KWON, Seyoun</au><au>YOON, Kyeongcheol</au><au>JEONG, Hyeonyeong</au><au>PARK, Haekeu</au><au>KIM, Seonmi</au><au>CHO, Sunghoon</au><au>LEE, Jeock</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEADSET INCLUDING IN-EAR MICROPHONE</title><date>2024-01-25</date><risdate>2024</risdate><abstract>A headset including an in-ear microphone is disclosed, the headset including a first frame including a first surface toward a first direction, a second surface toward a second direction opposite to the first direction, and a side surface surrounding at least part of a space between the first surface and the second surface, a speaker seating portion formed by recessing by a specific depth from a first portion of the first surface toward the second surface, a space formed between the speaker seating portion and the second surface, a speaker hole penetrated from the speaker seating portion to the space, a microphone hole penetrated from a second portion of the first surface to the space, an acoustic hole formed by penetrating the second surface from the space, a speaker seated in the speaker seating portion, a first printed circuit board disposed on the second portion and having a via hole connected with the microphone hole, a second printed circuit board electrically connected with the first printed circuit board and a connection unit of the speaker, and a microphone mounted at a position aligned with the via hole on the first printed circuit board. Various other embodiments identified in this document are also possible.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS |
| title | HEADSET INCLUDING IN-EAR MICROPHONE |
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