STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME

A stack package, and a method of manufacturing the same, includes a first encapsulant layer formed on a carrier. Also semiconductor dies are sequentially offset stacked on the first encapsulant layer. Vertical connectors connected to the semiconductor dies are formed. A second encapsulant layer coup...

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Hauptverfasser: LEE, Chae Sung, SUNG, Ki Jun
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LEE, Chae Sung
SUNG, Ki Jun
description A stack package, and a method of manufacturing the same, includes a first encapsulant layer formed on a carrier. Also semiconductor dies are sequentially offset stacked on the first encapsulant layer. Vertical connectors connected to the semiconductor dies are formed. A second encapsulant layer coupled to the first encapsulant layer is formed to encapsulate the vertical connectors and the semiconductor dies. Redistribution layers connected to the vertical connectors are formed on the second encapsulant layer.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME
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