APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM

A sintering apparatus for simultaneously sintering an electronic device onto a substrate, and a metallic sheet onto the electronic device includes a sinter tool and a compressible film positionable onto the metallic sheet and the electronic device. A thickness of the compressible film is greater tha...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN, Yi, DING, Jiapei, LIAO, Jian, KUAH, Teng Hock, YUAN, Bin
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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