ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishi...

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Hauptverfasser: FUNG, Jason G, JAWALI, Puneet Narendra, WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath, BARADANAHALLI KENCHAPPA, Nandan, MANZONIE, Adam Wade, LAWING, Andrew Scott, BAJAJ, Rajeev
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creator FUNG, Jason G
JAWALI, Puneet Narendra
WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath
BARADANAHALLI KENCHAPPA, Nandan
MANZONIE, Adam Wade
LAWING, Andrew Scott
BAJAJ, Rajeev
description Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS
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