GRINDING METHOD FOR SLICE WAFER

A wafer grinding method includes a step of forming a protective member on one side of a wafer, a first grinding step of grinding the other side of the wafer by setting a chuck-table rotating shaft and a grinding-stone rotating shaft at a first tilt correlation that has taken into consideration sinking of the wafer by compression of the protective member during grinding, and a second grinding step of grinding the wafer on its one side to a predetermined thickness by setting the shafts at a second tilt correlation such that a lower surface of the grinding stone, where the grinding stone is to be in contact with the wafer, and the holding surface become parallel, and bringing the grinding stone into contact at its lower surface with a radial segment of the one side of the wafer.