MICROELECTRONIC ASSEMBLIES INCLUDING STACKED DIES COUPLED BY A THROUGH DIELECTRIC VIA

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a plurality of dies stacked vertically; a trench of dielectric material extending through the plurality of dies; a conductive via extending through...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Majhi, Prashant, Mahajan, Ravindranath Vithal, Morein, Stephen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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