COOLING MODULE AND ELECTRONIC APPARATUS

A cooling module includes a fan, a heat sink, and a first heat pipe and a second heat pipe that are connected to a first surface of the heat sink. The heat sink includes a valley portion in which the second surface is recessed toward a side of the first surface, a first mountain portion that is betw...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tomizawa, Shusaku, Kitamura, Masahiro, Hashiba, Junki
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!