DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM

In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAMGAING, Telesphor, ZHOU, Zhen, CARLTON, Brent R, CHIU, Chia-Pin, LIU, Renzhi, HORINE, Bryce D, FOUST, Kenneth P, AMADJIKPE, Arnaud, VADLAMANI, Sai, YANG, Tae Young, ACIKALIN, Tolga, COX, Timothy F, MIX, Jason A
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KAMGAING, Telesphor
ZHOU, Zhen
CARLTON, Brent R
CHIU, Chia-Pin
LIU, Renzhi
HORINE, Bryce D
FOUST, Kenneth P
AMADJIKPE, Arnaud
VADLAMANI, Sai
YANG, Tae Young
ACIKALIN, Tolga
COX, Timothy F
MIX, Jason A
description In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023420396A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023420396A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023420396A13</originalsourceid><addsrcrecordid>eNrjZHB2cQ3zdHbVDfHXhbAUnP19fUP9PJ0dQzz9_RSCI4NDXH11FAIcnb0d3V2DdRQc_VxgPKgsDwNrWmJOcSovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2JDw02MjAyNjEyMLY0czQ0Jk4VAMCALC8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM</title><source>esp@cenet</source><creator>KAMGAING, Telesphor ; ZHOU, Zhen ; CARLTON, Brent R ; CHIU, Chia-Pin ; LIU, Renzhi ; HORINE, Bryce D ; FOUST, Kenneth P ; AMADJIKPE, Arnaud ; VADLAMANI, Sai ; YANG, Tae Young ; ACIKALIN, Tolga ; COX, Timothy F ; MIX, Jason A</creator><creatorcontrib>KAMGAING, Telesphor ; ZHOU, Zhen ; CARLTON, Brent R ; CHIU, Chia-Pin ; LIU, Renzhi ; HORINE, Bryce D ; FOUST, Kenneth P ; AMADJIKPE, Arnaud ; VADLAMANI, Sai ; YANG, Tae Young ; ACIKALIN, Tolga ; COX, Timothy F ; MIX, Jason A</creatorcontrib><description>In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231228&amp;DB=EPODOC&amp;CC=US&amp;NR=2023420396A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231228&amp;DB=EPODOC&amp;CC=US&amp;NR=2023420396A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAMGAING, Telesphor</creatorcontrib><creatorcontrib>ZHOU, Zhen</creatorcontrib><creatorcontrib>CARLTON, Brent R</creatorcontrib><creatorcontrib>CHIU, Chia-Pin</creatorcontrib><creatorcontrib>LIU, Renzhi</creatorcontrib><creatorcontrib>HORINE, Bryce D</creatorcontrib><creatorcontrib>FOUST, Kenneth P</creatorcontrib><creatorcontrib>AMADJIKPE, Arnaud</creatorcontrib><creatorcontrib>VADLAMANI, Sai</creatorcontrib><creatorcontrib>YANG, Tae Young</creatorcontrib><creatorcontrib>ACIKALIN, Tolga</creatorcontrib><creatorcontrib>COX, Timothy F</creatorcontrib><creatorcontrib>MIX, Jason A</creatorcontrib><title>DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM</title><description>In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB2cQ3zdHbVDfHXhbAUnP19fUP9PJ0dQzz9_RSCI4NDXH11FAIcnb0d3V2DdRQc_VxgPKgsDwNrWmJOcSovlOZmUHZzDXH20E0tyI9PLS5ITE7NSy2JDw02MjAyNjEyMLY0czQ0Jk4VAMCALC8</recordid><startdate>20231228</startdate><enddate>20231228</enddate><creator>KAMGAING, Telesphor</creator><creator>ZHOU, Zhen</creator><creator>CARLTON, Brent R</creator><creator>CHIU, Chia-Pin</creator><creator>LIU, Renzhi</creator><creator>HORINE, Bryce D</creator><creator>FOUST, Kenneth P</creator><creator>AMADJIKPE, Arnaud</creator><creator>VADLAMANI, Sai</creator><creator>YANG, Tae Young</creator><creator>ACIKALIN, Tolga</creator><creator>COX, Timothy F</creator><creator>MIX, Jason A</creator><scope>EVB</scope></search><sort><creationdate>20231228</creationdate><title>DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM</title><author>KAMGAING, Telesphor ; ZHOU, Zhen ; CARLTON, Brent R ; CHIU, Chia-Pin ; LIU, Renzhi ; HORINE, Bryce D ; FOUST, Kenneth P ; AMADJIKPE, Arnaud ; VADLAMANI, Sai ; YANG, Tae Young ; ACIKALIN, Tolga ; COX, Timothy F ; MIX, Jason A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023420396A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAMGAING, Telesphor</creatorcontrib><creatorcontrib>ZHOU, Zhen</creatorcontrib><creatorcontrib>CARLTON, Brent R</creatorcontrib><creatorcontrib>CHIU, Chia-Pin</creatorcontrib><creatorcontrib>LIU, Renzhi</creatorcontrib><creatorcontrib>HORINE, Bryce D</creatorcontrib><creatorcontrib>FOUST, Kenneth P</creatorcontrib><creatorcontrib>AMADJIKPE, Arnaud</creatorcontrib><creatorcontrib>VADLAMANI, Sai</creatorcontrib><creatorcontrib>YANG, Tae Young</creatorcontrib><creatorcontrib>ACIKALIN, Tolga</creatorcontrib><creatorcontrib>COX, Timothy F</creatorcontrib><creatorcontrib>MIX, Jason A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAMGAING, Telesphor</au><au>ZHOU, Zhen</au><au>CARLTON, Brent R</au><au>CHIU, Chia-Pin</au><au>LIU, Renzhi</au><au>HORINE, Bryce D</au><au>FOUST, Kenneth P</au><au>AMADJIKPE, Arnaud</au><au>VADLAMANI, Sai</au><au>YANG, Tae Young</au><au>ACIKALIN, Tolga</au><au>COX, Timothy F</au><au>MIX, Jason A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM</title><date>2023-12-28</date><risdate>2023</risdate><abstract>In various aspects, a device-to-device communication system is provided including a first device and a second device. Each of the first device and the second device includes an antenna, a radio frequency frond-end circuit, and a baseband circuit. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a cover structure housing the first device and the second device. Each of the first device and the second device are at least one of a chiplet or a package. The device-to-device communication system further includes a radio frequency signal interface wirelessly communicatively coupling the first device and the second device. The radio frequency signal interface includes the first antenna and the second antenna.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2023420396A1
source esp@cenet
subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title DEVICE-TO-DEVICE COMMUNICATION SYSTEM, PACKAGES, AND PACKAGE SYSTEM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T16%3A04%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAMGAING,%20Telesphor&rft.date=2023-12-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023420396A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true