ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES

ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES

An electronic device package comprises a substrate with a first side and a second side opposite the first side; a first conductive feature on the first side and having a first surface; a first dielectric material in contact with the first surface, wherein the first dielectric material has a first co...

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Hauptverfasser: Kong, Jieying, Steill, Jason, Nad, Suddhasattwa, Yang, Yi
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Kong, Jieying
Steill, Jason
Nad, Suddhasattwa
Yang, Yi
description An electronic device package comprises a substrate with a first side and a second side opposite the first side; a first conductive feature on the first side and having a first surface; a first dielectric material in contact with the first surface, wherein the first dielectric material has a first composition comprising silicon and nitrogen; a second conductive feature on the second side of the substrate and having a second surface; and a second dielectric material in contact with the second surface, wherein the second dielectric material has a second composition different than the first composition, and wherein a surface roughness of the second surface is greater than a surface roughness of the first surface.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRONIC PACKAGES
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