THIN DIE RELEASE FOR SEMICONDUCTOR DEVICE ASSEMBLY

Methods for releasing thinned semiconductor dies from a mount tape and associated apparatuses are disclosed. In one embodiment, a sacrificial layer may be disposed at a back side of thinned substrate including semiconductor dies. The sacrificial layer includes materials soluble in contact with a flu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bayless, Andrew M, Wirz, Brandon P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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