INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE

INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE

Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that...

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Hauptverfasser: Wu, Hung-Wen, Clark, Peter, Lu, Rui-Shen, Lin, Kuang-Hsi, Su, lou-Ren, Lin, Yu-Feng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator Wu, Hung-Wen
Clark, Peter
Lu, Rui-Shen
Lin, Kuang-Hsi
Su, lou-Ren
Lin, Yu-Feng
description Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that encloses the leak detection sensor and cooling fluid hose fittings so that leaked fluid is trapped within the enclosure for detection by the leak detection sensor. A planar cover couples to the frame upper side over the leak detection circuit and the cooling fluid hose fittings to provide ready assembly and an inexpensive adaptable form factor.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023413474A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023413474A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023413474A13</originalsourceid><addsrcrecordid>eNrjZHD29HPzD_J1DPH091PwcPRz8fH0c1cIjgwOcfVV8PEMDPV0UXD29weL-rg6eiu4uIa4OoNVu_o5-_gHhwa58jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjYxNDYxNzE0dDY-JUAQD8Uiyp</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE</title><source>esp@cenet</source><creator>Wu, Hung-Wen ; Clark, Peter ; Lu, Rui-Shen ; Lin, Kuang-Hsi ; Su, lou-Ren ; Lin, Yu-Feng</creator><creatorcontrib>Wu, Hung-Wen ; Clark, Peter ; Lu, Rui-Shen ; Lin, Kuang-Hsi ; Su, lou-Ren ; Lin, Yu-Feng</creatorcontrib><description>Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that encloses the leak detection sensor and cooling fluid hose fittings so that leaked fluid is trapped within the enclosure for detection by the leak detection sensor. A planar cover couples to the frame upper side over the leak detection circuit and the cooling fluid hose fittings to provide ready assembly and an inexpensive adaptable form factor.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231221&amp;DB=EPODOC&amp;CC=US&amp;NR=2023413474A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231221&amp;DB=EPODOC&amp;CC=US&amp;NR=2023413474A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wu, Hung-Wen</creatorcontrib><creatorcontrib>Clark, Peter</creatorcontrib><creatorcontrib>Lu, Rui-Shen</creatorcontrib><creatorcontrib>Lin, Kuang-Hsi</creatorcontrib><creatorcontrib>Su, lou-Ren</creatorcontrib><creatorcontrib>Lin, Yu-Feng</creatorcontrib><title>INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE</title><description>Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that encloses the leak detection sensor and cooling fluid hose fittings so that leaked fluid is trapped within the enclosure for detection by the leak detection sensor. A planar cover couples to the frame upper side over the leak detection circuit and the cooling fluid hose fittings to provide ready assembly and an inexpensive adaptable form factor.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD29HPzD_J1DPH091PwcPRz8fH0c1cIjgwOcfVV8PEMDPV0UXD29weL-rg6eiu4uIa4OoNVu_o5-_gHhwa58jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjYxNDYxNzE0dDY-JUAQD8Uiyp</recordid><startdate>20231221</startdate><enddate>20231221</enddate><creator>Wu, Hung-Wen</creator><creator>Clark, Peter</creator><creator>Lu, Rui-Shen</creator><creator>Lin, Kuang-Hsi</creator><creator>Su, lou-Ren</creator><creator>Lin, Yu-Feng</creator><scope>EVB</scope></search><sort><creationdate>20231221</creationdate><title>INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE</title><author>Wu, Hung-Wen ; Clark, Peter ; Lu, Rui-Shen ; Lin, Kuang-Hsi ; Su, lou-Ren ; Lin, Yu-Feng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023413474A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Wu, Hung-Wen</creatorcontrib><creatorcontrib>Clark, Peter</creatorcontrib><creatorcontrib>Lu, Rui-Shen</creatorcontrib><creatorcontrib>Lin, Kuang-Hsi</creatorcontrib><creatorcontrib>Su, lou-Ren</creatorcontrib><creatorcontrib>Lin, Yu-Feng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wu, Hung-Wen</au><au>Clark, Peter</au><au>Lu, Rui-Shen</au><au>Lin, Kuang-Hsi</au><au>Su, lou-Ren</au><au>Lin, Yu-Feng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE</title><date>2023-12-21</date><risdate>2023</risdate><abstract>Information handling system thermal management of processing components, such as CPU, GPU and/or memory, by a liquid cooling system is protected by a leak detection enclosure having a leak detection sensor disposed in an interior. The leak detection enclosure has a frame coupled to a cold plate that encloses the leak detection sensor and cooling fluid hose fittings so that leaked fluid is trapped within the enclosure for detection by the leak detection sensor. A planar cover couples to the frame upper side over the leak detection circuit and the cooling fluid hose fittings to provide ready assembly and an inexpensive adaptable form factor.</abstract><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title INFORMATION HANDLING SYSTEM LIQUID COOLING LEAK DETECTION ENCLOSURE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T23%3A30%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Wu,%20Hung-Wen&rft.date=2023-12-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023413474A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true