SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

A semiconductor package includes: a lower substrate; a semiconductor chip disposed on the lower substrate; an upper substrate disposed on the semiconductor chip, having a lower surface facing the semiconductor chip, and including step structures disposed below the lower surface; a connection structu...

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Hauptverfasser: Baek, Hyunggil, Kim, Sunchul, Park, Junwoo, Lee, Yongkwan, Lee, Juhyung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Baek, Hyunggil
Kim, Sunchul
Park, Junwoo
Lee, Yongkwan
Lee, Juhyung
description A semiconductor package includes: a lower substrate; a semiconductor chip disposed on the lower substrate; an upper substrate disposed on the semiconductor chip, having a lower surface facing the semiconductor chip, and including step structures disposed below the lower surface; a connection structure disposed around the semiconductor chip and connecting the lower substrate to the upper substrate; and an encapsulant filling a space between the lower substrate and the upper substrate and sealing at least a portion of each of the semiconductor chip and the connection structure. The lower surface of the upper substrate has a first surface portion on which the step structures are disposed and a second surface portion having a step with respect to the lower surface of the step structures, and the second surface portion extends between opposite edges of the upper substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR PACKAGE
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