SEMICONDUCTOR PACKAGE HAVING GROUND BONDING WIRE THAT CROSSES OVER SIGNAL BONDING WIRE FOR CROSSTALK REDUCTION AND ASSOCIATED METHOD

SEMICONDUCTOR PACKAGE HAVING GROUND BONDING WIRE THAT CROSSES OVER SIGNAL BONDING WIRE FOR CROSSTALK REDUCTION AND ASSOCIATED METHOD

A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device s...

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Hauptverfasser: Chen, Chun-Wei, Ko, Ming-Yin, Luo, Yan-Bin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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creator Chen, Chun-Wei
Ko, Ming-Yin
Luo, Yan-Bin
description A semiconductor package includes a printed circuit board (PCB), a semiconductor device, a first signal bonding wire, and a first ground bonding wire. The PCB includes a first PCB ground pad and a first PCB signal trace. The semiconductor device includes a first device ground pad and a first device signal pad. The first signal bonding wire is coupled between the first device signal pad and the first PCB signal trace. The first ground bonding wire is coupled between the first device ground pad and the first PCB ground pad, wherein the first ground bonding wire crosses over the first signal bonding wire.
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
title SEMICONDUCTOR PACKAGE HAVING GROUND BONDING WIRE THAT CROSSES OVER SIGNAL BONDING WIRE FOR CROSSTALK REDUCTION AND ASSOCIATED METHOD
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