LOW DENSITY COMPOSITIONS CONTAINING POLYETHER BLOCK AMIDES AND HOLLOW GLASS REINFORCEMENTS AND USE OF SAME

A molding composition including by weight: (A) 45% to 90%, particularly 60% to 80%, more particularly 62.5% to 77.5% of at least one copolyamide with amide units (Bal) and polyether units (Ba2), (B) 5% to 30%, particularly 10% to 20%, more particularly 12.5% to 17.5% of carbon fibers, (C) 5% to 20%,...

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Bibliographische Detailangaben
Hauptverfasser:	VINCENT, Guillaume, SABARD, Mathieu, TITTOTO, Cristian
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A molding composition including by weight: (A) 45% to 90%, particularly 60% to 80%, more particularly 62.5% to 77.5% of at least one copolyamide with amide units (Bal) and polyether units (Ba2), (B) 5% to 30%, particularly 10% to 20%, more particularly 12.5% to 17.5% of carbon fibers, (C) 5% to 20%, particularly 10% to 15% of a hollow glass reinforcement, (D) 0% to 5%, preferably 0.1% to 2% of at least one additive, the sum of the proportions of each constituent (A)+(B)+(C)+(D) of the composition being equal to 100%.