CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS
Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical...
Gespeichert in:
| Hauptverfasser: | , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | Wuester, Steven White, Justin Blakely, Colin Haberern, Kevin Reiherzer, Jesse Hall, Nikolas Check, Michael |
| description | Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical connections adjacent the active LED structures. Exemplary contact structures include contacts electrically coupled to active LED structures and dielectric structures beneath the contacts. Dielectric structures are arranged beneath portions of the contacts while still allowing electrical connections therethrough. Such dielectric structures may be provided as regions of dielectric material with spacings that control topography of underlying bonding metals to reduce voiding. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023395754A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023395754A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023395754A13</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHvxIOofFjwXtLGIx5hsmoU2kWTTaykST6KF-n9E8QGeZmBmWfTKO5aKIXJIilPACOSgpcZyiR0xk2tAk9cIytIlgvEBAuqkUEPvSX-6N3D27qsdsmzjuljcxvucNz-uiq1BVrbM03PI8zRe8yO_hhSrXSXEqT7WB7kX_11vVJsxmQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS</title><source>esp@cenet</source><creator>Wuester, Steven ; White, Justin ; Blakely, Colin ; Haberern, Kevin ; Reiherzer, Jesse ; Hall, Nikolas ; Check, Michael</creator><creatorcontrib>Wuester, Steven ; White, Justin ; Blakely, Colin ; Haberern, Kevin ; Reiherzer, Jesse ; Hall, Nikolas ; Check, Michael</creatorcontrib><description>Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical connections adjacent the active LED structures. Exemplary contact structures include contacts electrically coupled to active LED structures and dielectric structures beneath the contacts. Dielectric structures are arranged beneath portions of the contacts while still allowing electrical connections therethrough. Such dielectric structures may be provided as regions of dielectric material with spacings that control topography of underlying bonding metals to reduce voiding.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231207&DB=EPODOC&CC=US&NR=2023395754A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231207&DB=EPODOC&CC=US&NR=2023395754A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wuester, Steven</creatorcontrib><creatorcontrib>White, Justin</creatorcontrib><creatorcontrib>Blakely, Colin</creatorcontrib><creatorcontrib>Haberern, Kevin</creatorcontrib><creatorcontrib>Reiherzer, Jesse</creatorcontrib><creatorcontrib>Hall, Nikolas</creatorcontrib><creatorcontrib>Check, Michael</creatorcontrib><title>CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS</title><description>Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical connections adjacent the active LED structures. Exemplary contact structures include contacts electrically coupled to active LED structures and dielectric structures beneath the contacts. Dielectric structures are arranged beneath portions of the contacts while still allowing electrical connections therethrough. Such dielectric structures may be provided as regions of dielectric material with spacings that control topography of underlying bonding metals to reduce voiding.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHvxIOofFjwXtLGIx5hsmoU2kWTTaykST6KF-n9E8QGeZmBmWfTKO5aKIXJIilPACOSgpcZyiR0xk2tAk9cIytIlgvEBAuqkUEPvSX-6N3D27qsdsmzjuljcxvucNz-uiq1BVrbM03PI8zRe8yO_hhSrXSXEqT7WB7kX_11vVJsxmQ</recordid><startdate>20231207</startdate><enddate>20231207</enddate><creator>Wuester, Steven</creator><creator>White, Justin</creator><creator>Blakely, Colin</creator><creator>Haberern, Kevin</creator><creator>Reiherzer, Jesse</creator><creator>Hall, Nikolas</creator><creator>Check, Michael</creator><scope>EVB</scope></search><sort><creationdate>20231207</creationdate><title>CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS</title><author>Wuester, Steven ; White, Justin ; Blakely, Colin ; Haberern, Kevin ; Reiherzer, Jesse ; Hall, Nikolas ; Check, Michael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023395754A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Wuester, Steven</creatorcontrib><creatorcontrib>White, Justin</creatorcontrib><creatorcontrib>Blakely, Colin</creatorcontrib><creatorcontrib>Haberern, Kevin</creatorcontrib><creatorcontrib>Reiherzer, Jesse</creatorcontrib><creatorcontrib>Hall, Nikolas</creatorcontrib><creatorcontrib>Check, Michael</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wuester, Steven</au><au>White, Justin</au><au>Blakely, Colin</au><au>Haberern, Kevin</au><au>Reiherzer, Jesse</au><au>Hall, Nikolas</au><au>Check, Michael</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS</title><date>2023-12-07</date><risdate>2023</risdate><abstract>Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly contact structures in LED chips for reducing voiding of bonding metals are disclosed. LED chips include active LED structures on carrier submounts and contact structures arranged to receive external electrical connections adjacent the active LED structures. Exemplary contact structures include contacts electrically coupled to active LED structures and dielectric structures beneath the contacts. Dielectric structures are arranged beneath portions of the contacts while still allowing electrical connections therethrough. Such dielectric structures may be provided as regions of dielectric material with spacings that control topography of underlying bonding metals to reduce voiding.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2023395754A1 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | CONTACT STRUCTURES IN LIGHT-EMITTING DIODE CHIPS FOR REDUCED VOIDING OF BONDING METALS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T13%3A40%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Wuester,%20Steven&rft.date=2023-12-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023395754A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |