SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS
A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to la...
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| creator | Ku, Jeff Chuah, Tin Poay Loo, Twan Sing Lim, Min Suet Lim, Yew San |
| description | A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023395480A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023395480A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023395480A13</originalsourceid><addsrcrecordid>eNrjZHAKDnUKDglyDHFVCPFXcPJ3DHJR8PQLcQ1y9vfzc3UOUQj3DPFQ8PEMDPV0UfB1DXH0UXD0c1EIDg1yc3R2VQjw9AvmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGxpamJhYGjobGxKkCALMVLCY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS</title><source>esp@cenet</source><creator>Ku, Jeff ; Chuah, Tin Poay ; Loo, Twan Sing ; Lim, Min Suet ; Lim, Yew San</creator><creatorcontrib>Ku, Jeff ; Chuah, Tin Poay ; Loo, Twan Sing ; Lim, Min Suet ; Lim, Yew San</creatorcontrib><description>A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231207&DB=EPODOC&CC=US&NR=2023395480A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231207&DB=EPODOC&CC=US&NR=2023395480A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ku, Jeff</creatorcontrib><creatorcontrib>Chuah, Tin Poay</creatorcontrib><creatorcontrib>Loo, Twan Sing</creatorcontrib><creatorcontrib>Lim, Min Suet</creatorcontrib><creatorcontrib>Lim, Yew San</creatorcontrib><title>SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS</title><description>A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAKDnUKDglyDHFVCPFXcPJ3DHJR8PQLcQ1y9vfzc3UOUQj3DPFQ8PEMDPV0UfB1DXH0UXD0c1EIDg1yc3R2VQjw9AvmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGxpamJhYGjobGxKkCALMVLCY</recordid><startdate>20231207</startdate><enddate>20231207</enddate><creator>Ku, Jeff</creator><creator>Chuah, Tin Poay</creator><creator>Loo, Twan Sing</creator><creator>Lim, Min Suet</creator><creator>Lim, Yew San</creator><scope>EVB</scope></search><sort><creationdate>20231207</creationdate><title>SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS</title><author>Ku, Jeff ; Chuah, Tin Poay ; Loo, Twan Sing ; Lim, Min Suet ; Lim, Yew San</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023395480A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Ku, Jeff</creatorcontrib><creatorcontrib>Chuah, Tin Poay</creatorcontrib><creatorcontrib>Loo, Twan Sing</creatorcontrib><creatorcontrib>Lim, Min Suet</creatorcontrib><creatorcontrib>Lim, Yew San</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ku, Jeff</au><au>Chuah, Tin Poay</au><au>Loo, Twan Sing</au><au>Lim, Min Suet</au><au>Lim, Yew San</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS</title><date>2023-12-07</date><risdate>2023</risdate><abstract>A substrate to printed circuit board (PCB) interconnect with liquid metal and surface pins. A thin dielectric sheet with drilled openings is adjacent to the bottom of a system on chip or CPU package substrate. Holes in the dielectric sheet have a liquid metal (LM) therein, the holes correspond to landing metal pads on the package substrate. The PCB includes surface pins in an arrangement to match the LM filled holes. A pick and place assembly of the package substrate to the PCB can be done without needing a reflow step. A magnet ring can be positioned on the polyimide sheet and configured to pair with a metal plate on the PCB. Guideposts around the periphery of the package substrate may be used to assist in alignment during assembly.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | SUBSTRATE TO BOARD INTERCONNECT WITH LIQUID METAL AND SURFACE PINS |
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