Semiconductor Device and Method of Disposing Electrical Components Over Side Surfaces of Interconnect Substrate

A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a side surface of the interconnect substrate....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, GunHyuck, Lee, HeeSoo, Son, SangHyun, Hwang, Bokyeong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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