Protector Cap for Package with Thermal Interface Material

A method of manufacturing a package includes mounting an electronic component on an electrically conductive carrier, encapsulating part of the carrier and the electronic component by an encapsulant, covering an exposed surface portion of the carrier with an electrically insulating and thermally cond...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Khoo, Nee Wan, Kasztelan, Christian
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!