SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig p...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUMOTO, Masashi, SHINDO, Osamu, KOIZUMI, Hiroshi, MAKIDA, Mitsuyoshi, SHINDO, Ryo, MIYAGOSHI, Toshinobu, KATO, Yasuo, SUNAGA, Seijiro, SATO, Yohei, YAMASHITA, Makoto
Format:	Patent
Sprache:	eng
Schlagworte:	PERFORMING OPERATIONS PRESSES PRESSES IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate processing apparatus 10 applies pressure to a substrate 2 which is an object to be pressurized arranged on an upper jig plate 44. The substrate processing apparatus 10 includes a lower jig plate 46 arranged below the upper jig plate 44, an installation base 47 provided on the lower jig plate 46 and the substrate 2 is arranged; and the installation base is temporarily fixed to the installation base 47 in a deformable manner.