MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

An example microelectronic device package includes: a multilayer package substrate comprising routing conductors spaced by dielectric material, the multilayer package substrate having a device side surface and an opposing board side surface, and having a recessed portion extending from the device si...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Barbadillo, Julian Carlo, Ankamah-Kusi, Sylvester, Travis, Blake, Molina, John Carlo, Murugan, Rajen, Kronenberg, Thomas, Noquil, Jonathan, Colte, Jason, Lo, Chun Ping, Li, Guangxu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!