MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

An example microelectronic device package includes: a multilayer package substrate comprising routing conductors spaced by dielectric material, the multilayer package substrate having a device side surface and an opposing board side surface, and having a recessed portion extending from the device si...

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Bibliographische Detailangaben
Hauptverfasser: Barbadillo, Julian Carlo, Ankamah-Kusi, Sylvester, Travis, Blake, Molina, John Carlo, Murugan, Rajen, Kronenberg, Thomas, Noquil, Jonathan, Colte, Jason, Lo, Chun Ping, Li, Guangxu
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An example microelectronic device package includes: a multilayer package substrate comprising routing conductors spaced by dielectric material, the multilayer package substrate having a device side surface and an opposing board side surface, and having a recessed portion extending from the device side surface and exposing routing conductors beneath the device side surface of the multilayer package substrate; a semiconductor die mounted to the device side surface of the multilayer package substrate and coupled to the routing conductors; a passive component mounted to the routing conductors exposed in the recessed portion of the multilayer package substrate; and mold compound covering the semiconductor die, the passive component, and a portion of the multilayer package substrate.