SEMICONDUCTOR BONDING TOOL AND METHOD OF OPERATING THE SAME

A bag is filled with liquid, instead of an airbag filled with gas, to deform a bottom wafer toward a top wafer during a wafer bonding process. As a result, the liquid is less susceptible to temperature changes, which reduces run-out variation across wafer bonding processes. Reducing run-out variatio...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG, Ching-Hung, LIN, Yeong-Jyh, YU, Tzu-Wei, LI, Ching I
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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