METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Provided is a method for manufacturing a semiconductor device, in which a mask layer, a buffer layer, and a first mandrel layer are sequentially stacked on a substrate including a first region and a second region. First mandrel patterns are formed on the buffer layer in the first region, and a secon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hong, Jungpyo, Chung, Sanggyo, Lee, Chanmi, Han, Seunghee
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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