HYBRID MICRO-BUMP INTEGRATION WITH REDISTRIBUTION LAYER

A semiconductor device includes a substrate; an interconnect structure over the substrate; a first passivation layer over the interconnect structure; a first conductive pad, a second conductive pad, and a conductive line disposed over the first passivation layer and electrically coupled to conductiv...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yang, Ting-Li, Yang, Sheng-Pin, Wu, Yi-Wen, Liu, Hao-Chun, Tsai, Po-Hao
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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