SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

A method of manufacturing a semiconductor device packaging panel is provided. The method includes forming a panel having an active side and a backside. The panel includes a plurality of semiconductor die encapsulated with an encapsulant. An active surface of the semiconductor die is exposed on the a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gan, Richard Te, Gupta, Vivek, Vincent, Michael B, Gong, Zhiwei, Hayes, Scott M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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