HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE

HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE

A heat spreader can be used with a semiconductor component. The heat spreader includes: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wh...

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Hauptverfasser: PARK, YoSep, KIM, KyungEun, PARK, SooHan, RA, InWeon
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator PARK, YoSep
KIM, KyungEun
PARK, SooHan
RA, InWeon
description A heat spreader can be used with a semiconductor component. The heat spreader includes: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component when the heat spreader is mounted with the semiconductor component.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE
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