METHOD FOR CONTROLLING SUBSTRATE CARRIER OF DEPOSITION APPARATUS
A method for a deposition apparatus is disclosed. The deposition apparatus includes a chamber, a substrate carrier, a blocker and a cover ring. The cover ring is disposed on the blocker. The substrate carrier carries a wafer and moves with respect to the blocker. A position where the substrate carri...
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| creator | LIN, JINGNG |
| description | A method for a deposition apparatus is disclosed. The deposition apparatus includes a chamber, a substrate carrier, a blocker and a cover ring. The cover ring is disposed on the blocker. The substrate carrier carries a wafer and moves with respect to the blocker. A position where the substrate carrier contacts the cover ring start is defined as a contact position, and a first position below the contact position and a second position above the contact position are also defined. When the reaching the first position, a movement speed of the substrate carrier is decreased, and the substrate carrier carries the cover ring to move away from the blocker. When reaching the second position, the movement speed of the substrate carrier away from the blocker is increased. Collision between the wafer and the deposition apparatus is eliminated to prevent undesired particles from occurring and the wafer from being damaged. |
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The cover ring is disposed on the blocker. The substrate carrier carries a wafer and moves with respect to the blocker. A position where the substrate carrier contacts the cover ring start is defined as a contact position, and a first position below the contact position and a second position above the contact position are also defined. When the reaching the first position, a movement speed of the substrate carrier is decreased, and the substrate carrier carries the cover ring to move away from the blocker. When reaching the second position, the movement speed of the substrate carrier away from the blocker is increased. Collision between the wafer and the deposition apparatus is eliminated to prevent undesired particles from occurring and the wafer from being damaged.</description><language>eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231116&DB=EPODOC&CC=US&NR=2023366090A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231116&DB=EPODOC&CC=US&NR=2023366090A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIN, JINGNG</creatorcontrib><title>METHOD FOR CONTROLLING SUBSTRATE CARRIER OF DEPOSITION APPARATUS</title><description>A method for a deposition apparatus is disclosed. 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The deposition apparatus includes a chamber, a substrate carrier, a blocker and a cover ring. The cover ring is disposed on the blocker. The substrate carrier carries a wafer and moves with respect to the blocker. A position where the substrate carrier contacts the cover ring start is defined as a contact position, and a first position below the contact position and a second position above the contact position are also defined. When the reaching the first position, a movement speed of the substrate carrier is decreased, and the substrate carrier carries the cover ring to move away from the blocker. When reaching the second position, the movement speed of the substrate carrier away from the blocker is increased. Collision between the wafer and the deposition apparatus is eliminated to prevent undesired particles from occurring and the wafer from being damaged.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | METHOD FOR CONTROLLING SUBSTRATE CARRIER OF DEPOSITION APPARATUS |
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