IMPROVED THROUGH-PLANE THERMAL CONDUCTIVITY USING FOAM INJECTION MOLDING WITH CORE-BACK TECHNOLOGY

IMPROVED THROUGH-PLANE THERMAL CONDUCTIVITY USING FOAM INJECTION MOLDING WITH CORE-BACK TECHNOLOGY

In various aspects, the disclosure relates to a method of forming a molded article comprising: combining, to form a blend, a polymer base resin and a thermally conductive filler, wherein the thermally conductive filler comprises a platelet filler having a thickness between 100 nm and 10 microns; fee...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VAN ERP, Tim, YANEV, Angel, MERCX, Frans
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:In various aspects, the disclosure relates to a method of forming a molded article comprising: combining, to form a blend, a polymer base resin and a thermally conductive filler, wherein the thermally conductive filler comprises a platelet filler having a thickness between 100 nm and 10 microns; feeding the blend to a mold cavity of a suitable molding apparatus, wherein the mold cavity has a mold portion that may be retracted in a through-plane direction; foaming the blend to allow a pressure drop; and retracting the mold portion in the through-plane direction to provide the molded article.