VENTILATED HOUSING FOR ELECTRONIC DEVICES
A housing may comprise a first surface comprising one or more ventilation openings and a second surface comprising one or more ventilation openings. The one or more ventilation openings of the first surface may be located in a recessed groove of the first surface. The second surface may be substanti...
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| creator | MCGINNIS, Sean CUETO, Osman JOU, Michael |
| description | A housing may comprise a first surface comprising one or more ventilation openings and a second surface comprising one or more ventilation openings. The one or more ventilation openings of the first surface may be located in a recessed groove of the first surface. The second surface may be substantially perpendicular to the first surface. The housing may enable air to flow through the one or more ventilation openings of the first surface and the one or more ventilation openings of the second surface to direct heat away from the one or more internal components of the housing. The arrangement of the one or more ventilation openings may enable one or more housings to be stacked on top of each other without impeding air flow through the one or more ventilation openings of the first surface and/or the one or more ventilation openings of the second surface. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023354545A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023354545A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023354545A13</originalsourceid><addsrcrecordid>eNrjZNAMc_UL8fRxDHF1UfDwDw329HNXcPMPUnD1cXUOCfL383RWcHEN83R2DeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsbGpiZA6GhoTJwqAMojJWU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>VENTILATED HOUSING FOR ELECTRONIC DEVICES</title><source>esp@cenet</source><creator>MCGINNIS, Sean ; CUETO, Osman ; JOU, Michael</creator><creatorcontrib>MCGINNIS, Sean ; CUETO, Osman ; JOU, Michael</creatorcontrib><description>A housing may comprise a first surface comprising one or more ventilation openings and a second surface comprising one or more ventilation openings. The one or more ventilation openings of the first surface may be located in a recessed groove of the first surface. The second surface may be substantially perpendicular to the first surface. The housing may enable air to flow through the one or more ventilation openings of the first surface and the one or more ventilation openings of the second surface to direct heat away from the one or more internal components of the housing. The arrangement of the one or more ventilation openings may enable one or more housings to be stacked on top of each other without impeding air flow through the one or more ventilation openings of the first surface and/or the one or more ventilation openings of the second surface.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231102&DB=EPODOC&CC=US&NR=2023354545A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231102&DB=EPODOC&CC=US&NR=2023354545A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MCGINNIS, Sean</creatorcontrib><creatorcontrib>CUETO, Osman</creatorcontrib><creatorcontrib>JOU, Michael</creatorcontrib><title>VENTILATED HOUSING FOR ELECTRONIC DEVICES</title><description>A housing may comprise a first surface comprising one or more ventilation openings and a second surface comprising one or more ventilation openings. The one or more ventilation openings of the first surface may be located in a recessed groove of the first surface. The second surface may be substantially perpendicular to the first surface. The housing may enable air to flow through the one or more ventilation openings of the first surface and the one or more ventilation openings of the second surface to direct heat away from the one or more internal components of the housing. The arrangement of the one or more ventilation openings may enable one or more housings to be stacked on top of each other without impeding air flow through the one or more ventilation openings of the first surface and/or the one or more ventilation openings of the second surface.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMc_UL8fRxDHF1UfDwDw329HNXcPMPUnD1cXUOCfL383RWcHEN83R2DeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsbGpiZA6GhoTJwqAMojJWU</recordid><startdate>20231102</startdate><enddate>20231102</enddate><creator>MCGINNIS, Sean</creator><creator>CUETO, Osman</creator><creator>JOU, Michael</creator><scope>EVB</scope></search><sort><creationdate>20231102</creationdate><title>VENTILATED HOUSING FOR ELECTRONIC DEVICES</title><author>MCGINNIS, Sean ; CUETO, Osman ; JOU, Michael</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023354545A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MCGINNIS, Sean</creatorcontrib><creatorcontrib>CUETO, Osman</creatorcontrib><creatorcontrib>JOU, Michael</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MCGINNIS, Sean</au><au>CUETO, Osman</au><au>JOU, Michael</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>VENTILATED HOUSING FOR ELECTRONIC DEVICES</title><date>2023-11-02</date><risdate>2023</risdate><abstract>A housing may comprise a first surface comprising one or more ventilation openings and a second surface comprising one or more ventilation openings. The one or more ventilation openings of the first surface may be located in a recessed groove of the first surface. The second surface may be substantially perpendicular to the first surface. The housing may enable air to flow through the one or more ventilation openings of the first surface and the one or more ventilation openings of the second surface to direct heat away from the one or more internal components of the housing. The arrangement of the one or more ventilation openings may enable one or more housings to be stacked on top of each other without impeding air flow through the one or more ventilation openings of the first surface and/or the one or more ventilation openings of the second surface.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | VENTILATED HOUSING FOR ELECTRONIC DEVICES |
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