FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

A fan-out stacked semiconductor package structure and a packaging method thereof are disclosed. The structure includes a three-dimensional memory chip package unit and a two-dimensional fan-out peripheral circuit chip SiP package unit. The three-dimensional memory chip package unit includes: at leas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Chen, Yenheng, Lin, Chengchung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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