SURFACE MOUNT DEVICE BONDED TO AN INNER LAYER OF A MULTI-LAYER SUBSTRATE

An apparatus includes a primary layer of a substrate. The apparatus includes a secondary layer of the substrate having a first open area that extends through the secondary layer to an inner layer of the substrate. The apparatus includes the inner layer of the substrate that is positioned between the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Boo, Kelvin Tan Aik, Chong, Chin Hui, Ye, Seng Kim, Ng, Hong Wan, Takiar, Hem P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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