3D INTEGRATED CHIPS WITH MICROFLUIDIC COOLING

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.

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Bibliographische Detailangaben
Hauptverfasser:	PETERSON, Eric C, TRIEU, Dennis, RAMAKRISHNAN, Bharath, BELADY, Christian L, ALISSA, Husam Atallah
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, at least one pin fin positioned in the microfluidic volume, and a boiling enhancement surface feature positioned on a pin surface of the pin fin.