METHOD AND CHAMBER FOR BACKSIDE PHYSICAL VAPOR DEPOSITION

Embodiments of the present disclosure generally relate to methods and apparatus for backside stress engineering of substrates to combat film stresses and bowing issues. In one embodiment, a method of depositing a film layer on a backside of a substrate is provided. The method includes flipping a sub...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RAMALINGAM, Jothilingam, MORAES, Kevin Vincent, LAVAN, Shane, CAO, Yong, ZHOU, Chunming
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!