COMPOSITION FOR SEMICONDUCTOR PROCESSING AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

A composition for semiconductor processing includes abrasive particles, and a dishing control additive, comprising a first dishing control additive and a second dishing control additive. The first dishing control additive includes a compound having a betaine group and a salicylic group or a derivati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK, Han Teo, CHOI, Yongsoo, MYUNG, Kangsik, HAN, Deok Su, HONG, Seung Chul
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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