ELECTRONIC DEVICE
An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic de...
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creator | Ptak, Olivier Kimmich, Georg Hajji, Ouafa |
description | An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic device separated from the substrate by at least a portion of the first coating layer and being offset with respect to the first region of the substrate so that the radiation element does not cover the electronic chip. The radiation element is buried in the first coating layer or is arranged in the first coating layer and partly covered with a protection material. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023318171A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023318171A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023318171A13</originalsourceid><addsrcrecordid>eNrjZBB09XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsbGhhaG5oaOhsbEqQIAkBsenA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>Ptak, Olivier ; Kimmich, Georg ; Hajji, Ouafa</creator><creatorcontrib>Ptak, Olivier ; Kimmich, Georg ; Hajji, Ouafa</creatorcontrib><description>An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic device separated from the substrate by at least a portion of the first coating layer and being offset with respect to the first region of the substrate so that the radiation element does not cover the electronic chip. The radiation element is buried in the first coating layer or is arranged in the first coating layer and partly covered with a protection material.</description><language>eng</language><subject>ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231005&DB=EPODOC&CC=US&NR=2023318171A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231005&DB=EPODOC&CC=US&NR=2023318171A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ptak, Olivier</creatorcontrib><creatorcontrib>Kimmich, Georg</creatorcontrib><creatorcontrib>Hajji, Ouafa</creatorcontrib><title>ELECTRONIC DEVICE</title><description>An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic device separated from the substrate by at least a portion of the first coating layer and being offset with respect to the first region of the substrate so that the radiation element does not cover the electronic chip. The radiation element is buried in the first coating layer or is arranged in the first coating layer and partly covered with a protection material.</description><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB09XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsbGhhaG5oaOhsbEqQIAkBsenA</recordid><startdate>20231005</startdate><enddate>20231005</enddate><creator>Ptak, Olivier</creator><creator>Kimmich, Georg</creator><creator>Hajji, Ouafa</creator><scope>EVB</scope></search><sort><creationdate>20231005</creationdate><title>ELECTRONIC DEVICE</title><author>Ptak, Olivier ; Kimmich, Georg ; Hajji, Ouafa</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023318171A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>Ptak, Olivier</creatorcontrib><creatorcontrib>Kimmich, Georg</creatorcontrib><creatorcontrib>Hajji, Ouafa</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Ptak, Olivier</au><au>Kimmich, Georg</au><au>Hajji, Ouafa</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE</title><date>2023-10-05</date><risdate>2023</risdate><abstract>An electronic device includes an electronic chip assembled on a first region of a substrate of the electronic device, a first coating layer of a first coating material covering a surface of the electronic chip facing away from the substrate, and a radiation element of an antenna of the electronic device separated from the substrate by at least a portion of the first coating layer and being offset with respect to the first region of the substrate so that the radiation element does not cover the electronic chip. The radiation element is buried in the first coating layer or is arranged in the first coating layer and partly covered with a protection material.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | ELECTRONIC DEVICE |
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