PHOTONIC COMMUNICATION PLATFORM, PACKAGES AND RELATED FABRICATION

Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments pr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Eslampour, Hamid, Carr, James, Gupta, Shashank
Format:	Patent
Sprache:	eng
Schlagworte:	OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS
Online-Zugang:	Volltext bestellen
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