DOUBLE IO PAD CELL INCLUDING ELECTROSTATIC DISCHARGE PROTECTION SCHEME WITH REDUCED LATCH-UP RISK
A double IO pad cell including a busing frame formed on a busing metal layer aligned with a same-sized component frame integrated on a component layer of an IC. The busing frame includes first and second IO pads, a supply voltage rail, and a ground voltage rail. The component frame includes first an...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Moosa, Mohamed Suleman Stockinger, Michael A |
description | A double IO pad cell including a busing frame formed on a busing metal layer aligned with a same-sized component frame integrated on a component layer of an IC. The busing frame includes first and second IO pads, a supply voltage rail, and a ground voltage rail. The component frame includes first and second primary ESD circuitry each including a first diode coupled between a respective one of the first and second IO pads and the supply voltage rail and a second diode coupled between the respective IO pad and the ground voltage rail. The second diodes of each primary ESD circuitry are integrated adjacent each other sandwiched between the first diodes which act as collector guard bands for the second diodes. The diodes of each primary ESD circuitry of the component frame are aligned with a corresponding one of the first and second IO pads of the busing frame. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023307440A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023307440A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023307440A13</originalsourceid><addsrcrecordid>eNqNikEKwjAQAHPxIOofFjwLtS14jpu1XYxJSTZ4LEXiSbRQ_48VfICngZlZqsH4dLQE7KHTBpCsBXZok2HXAFlCCT6KFkYwHLHVoSHogpe5sHcwK7oQXFlaCGQSkgGrBdtd6iBwPK_V4j48prz5caW2J_r2PL76PI3DLT_zu0-xLMqqKg51Xeh99d_1AV07NF4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DOUBLE IO PAD CELL INCLUDING ELECTROSTATIC DISCHARGE PROTECTION SCHEME WITH REDUCED LATCH-UP RISK</title><source>esp@cenet</source><creator>Moosa, Mohamed Suleman ; Stockinger, Michael A</creator><creatorcontrib>Moosa, Mohamed Suleman ; Stockinger, Michael A</creatorcontrib><description>A double IO pad cell including a busing frame formed on a busing metal layer aligned with a same-sized component frame integrated on a component layer of an IC. The busing frame includes first and second IO pads, a supply voltage rail, and a ground voltage rail. The component frame includes first and second primary ESD circuitry each including a first diode coupled between a respective one of the first and second IO pads and the supply voltage rail and a second diode coupled between the respective IO pad and the ground voltage rail. The second diodes of each primary ESD circuitry are integrated adjacent each other sandwiched between the first diodes which act as collector guard bands for the second diodes. The diodes of each primary ESD circuitry of the component frame are aligned with a corresponding one of the first and second IO pads of the busing frame.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS ; GENERATION ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230928&DB=EPODOC&CC=US&NR=2023307440A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230928&DB=EPODOC&CC=US&NR=2023307440A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Moosa, Mohamed Suleman</creatorcontrib><creatorcontrib>Stockinger, Michael A</creatorcontrib><title>DOUBLE IO PAD CELL INCLUDING ELECTROSTATIC DISCHARGE PROTECTION SCHEME WITH REDUCED LATCH-UP RISK</title><description>A double IO pad cell including a busing frame formed on a busing metal layer aligned with a same-sized component frame integrated on a component layer of an IC. The busing frame includes first and second IO pads, a supply voltage rail, and a ground voltage rail. The component frame includes first and second primary ESD circuitry each including a first diode coupled between a respective one of the first and second IO pads and the supply voltage rail and a second diode coupled between the respective IO pad and the ground voltage rail. The second diodes of each primary ESD circuitry are integrated adjacent each other sandwiched between the first diodes which act as collector guard bands for the second diodes. The diodes of each primary ESD circuitry of the component frame are aligned with a corresponding one of the first and second IO pads of the busing frame.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS</subject><subject>GENERATION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNikEKwjAQAHPxIOofFjwLtS14jpu1XYxJSTZ4LEXiSbRQ_48VfICngZlZqsH4dLQE7KHTBpCsBXZok2HXAFlCCT6KFkYwHLHVoSHogpe5sHcwK7oQXFlaCGQSkgGrBdtd6iBwPK_V4j48prz5caW2J_r2PL76PI3DLT_zu0-xLMqqKg51Xeh99d_1AV07NF4</recordid><startdate>20230928</startdate><enddate>20230928</enddate><creator>Moosa, Mohamed Suleman</creator><creator>Stockinger, Michael A</creator><scope>EVB</scope></search><sort><creationdate>20230928</creationdate><title>DOUBLE IO PAD CELL INCLUDING ELECTROSTATIC DISCHARGE PROTECTION SCHEME WITH REDUCED LATCH-UP RISK</title><author>Moosa, Mohamed Suleman ; Stockinger, Michael A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023307440A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS</topic><topic>GENERATION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Moosa, Mohamed Suleman</creatorcontrib><creatorcontrib>Stockinger, Michael A</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Moosa, Mohamed Suleman</au><au>Stockinger, Michael A</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DOUBLE IO PAD CELL INCLUDING ELECTROSTATIC DISCHARGE PROTECTION SCHEME WITH REDUCED LATCH-UP RISK</title><date>2023-09-28</date><risdate>2023</risdate><abstract>A double IO pad cell including a busing frame formed on a busing metal layer aligned with a same-sized component frame integrated on a component layer of an IC. The busing frame includes first and second IO pads, a supply voltage rail, and a ground voltage rail. The component frame includes first and second primary ESD circuitry each including a first diode coupled between a respective one of the first and second IO pads and the supply voltage rail and a second diode coupled between the respective IO pad and the ground voltage rail. The second diodes of each primary ESD circuitry are integrated adjacent each other sandwiched between the first diodes which act as collector guard bands for the second diodes. The diodes of each primary ESD circuitry of the component frame are aligned with a corresponding one of the first and second IO pads of the busing frame.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US2023307440A1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS GENERATION SEMICONDUCTOR DEVICES |
title | DOUBLE IO PAD CELL INCLUDING ELECTROSTATIC DISCHARGE PROTECTION SCHEME WITH REDUCED LATCH-UP RISK |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T21%3A12%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Moosa,%20Mohamed%20Suleman&rft.date=2023-09-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023307440A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |