OPERATION METHOD OF ETCHING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

An operation method of an etching apparatus includes transferring, from a load lock chamber to a process chamber, a substrate on which an etching target layer is formed, first etching the etching target layer on the substrate in a first etching time, transferring the substrate to a storage location...

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Bibliographische Detailangaben
Hauptverfasser: Yang, Janggyoo, Choi, Myungsun, Ha, Jaemin, Park, Soonam, Gwak, Dooyoung
Format: Patent
Sprache:eng
Schlagworte:
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