ELECTROCONDUCTIVE ADHESIVE

The present invention provides an electroconductive adhesive which is desirably sintered at low temperatures even without pressurization during the sintering of the electroconductive adhesive, and which forms a sintered body that has high denseness and high mechanical strength (shear strength) if us...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MINAMI, Junichirou, KATOU, Ryo, OKUDA, Masatoshi, MORI, Takamichi
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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