COMPLIANT MECHANICAL SYSTEM FOR MINI/MICRO CHIP MASS TRANSFER AND PACKAGING

A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexib...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHEN, Xin, GAO, Jian, CHEN, Xun, LIAO, Zhishen, LIN, Zhihang, LIU, Qiang, TANG, Hui
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexible hinges, and a pricking pin. The first thorn die attach drive devices and the second thorn die attach drive devices are mounted on the drive support plate. A drive end of the first thorn die attach drive device horizontally passes rightward through the first flexible hinge at a corresponding position; a drive end of the second thorn die attach drive device horizontally passes leftward through the first flexible hinge at a corresponding position; and the mounting base is hinged to the drive ends of the two thorn die attach drive devices through the second flexible hinges.