Integrated Assemblies and Methods of Forming Integrated Assemblies

Some embodiments include an integrated assembly having a vertical stack of alternating insulative levels and conductive levels. The insulative levels have a same primary composition as one another. At least one of the insulative levels is compositionally different relative to others of the insulativ...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wu, Jeslin J, Tiwari, Chandra, Abdelrahaman, Ramey M, Shrotri, Kunal, Lengade, Swapnil
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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