HEAT SINK BASE AND HEAT SINK

HEAT SINK BASE AND HEAT SINK

Disclosed are a heat sink base and a heat sink. The heat sink base includes a base body. The bottom of the base body is provided with at least one protruded structure, and the bottom of the base body abuts against the top of the CPU. Each of the at least one protruded structure includes a gentle reg...

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Hauptverfasser: LOU, Yaojia, XIA, Edward, ZHAO, Dangsheng, LI, Heng, DING, Yijia, LU, Lucas, LI, Yan
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator LOU, Yaojia
XIA, Edward
ZHAO, Dangsheng
LI, Heng
DING, Yijia
LU, Lucas
LI, Yan
description Disclosed are a heat sink base and a heat sink. The heat sink base includes a base body. The bottom of the base body is provided with at least one protruded structure, and the bottom of the base body abuts against the top of the CPU. Each of the at least one protruded structure includes a gentle region with a protrusion, and a slope region surrounding the protruded gentle region with the protrusion. The gentle region of the protruded structure abuts against a high heat flux region at the top of the CPU, thus forming a region with relatively high pressure and relatively stable pressure compared with the slope region. Therefore, the heat sink base provided by the present invention has a simple and reasonable structure, and can efficiently dissipate the heat generated by the CPU, thus improving the cooling efficiency and obtaining more stable and more consistent cooling performance.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title HEAT SINK BASE AND HEAT SINK
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