POLISHING APPARATUS FOR SUBSTRATE AND POLISHING METHOD FOR SUBSTRATE USING THE SAME

A polishing apparatus for a substrate, includes: a platen having a polishing pad attached to an upper surface thereof, and configured to rotate in a rotational direction, a temperature control unit configured to spray a temperature control fluid onto the polishing pad, a slurry supply unit configure...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Hyojung, Min, Chungki, Jang, Kihoon, Kwon, Donghoon
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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