SEPARATION METHOD AND ASSEMBLY FOR CHIP-ON-WAFER PROCESSING

A method for separating semiconductor die stacks of a chip-on-wafer assembly is disclosed herein. In one example, divider walls are arranged in a pattern on a first surface of a device wafer such that regions between the divider walls define mounting sites. Die stacks are mounted to the device wafer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bitz, Bradley R, Bayless, Andrew M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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