SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

Provided is a semiconductor device including: a first trench contact portion provided to an inside of a contact region; a second trench contact portion provided to an inside of an emitter region; a first plug portion of a second conductivity type, which is provided in contact with a lower end of the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HAMASAKI, Ryutaro, YAMADA, Takuya, NOGUCHI, Seiji, SAKURAI, Yosuke, OZAKI, Daisuke
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!