CURVED WAFER STAGE

CURVED WAFER STAGE

The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: van der Veen, Gijs, Houben, Patrick, Stokkermans, Joep, Wesselingh, Jasper
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator van der Veen, Gijs
Houben, Patrick
Stokkermans, Joep
Wesselingh, Jasper
description The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023260954A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023260954A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023260954A13</originalsourceid><addsrcrecordid>eNrjZBByDg0Kc3VRCHd0cw1SCA5xdHflYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGRmYGlqYmjobGxKkCAKsFHuE</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CURVED WAFER STAGE</title><source>esp@cenet</source><creator>van der Veen, Gijs ; Houben, Patrick ; Stokkermans, Joep ; Wesselingh, Jasper</creator><creatorcontrib>van der Veen, Gijs ; Houben, Patrick ; Stokkermans, Joep ; Wesselingh, Jasper</creatorcontrib><description>The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230817&amp;DB=EPODOC&amp;CC=US&amp;NR=2023260954A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230817&amp;DB=EPODOC&amp;CC=US&amp;NR=2023260954A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>van der Veen, Gijs</creatorcontrib><creatorcontrib>Houben, Patrick</creatorcontrib><creatorcontrib>Stokkermans, Joep</creatorcontrib><creatorcontrib>Wesselingh, Jasper</creatorcontrib><title>CURVED WAFER STAGE</title><description>The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBByDg0Kc3VRCHd0cw1SCA5xdHflYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBkbGRmYGlqYmjobGxKkCAKsFHuE</recordid><startdate>20230817</startdate><enddate>20230817</enddate><creator>van der Veen, Gijs</creator><creator>Houben, Patrick</creator><creator>Stokkermans, Joep</creator><creator>Wesselingh, Jasper</creator><scope>EVB</scope></search><sort><creationdate>20230817</creationdate><title>CURVED WAFER STAGE</title><author>van der Veen, Gijs ; Houben, Patrick ; Stokkermans, Joep ; Wesselingh, Jasper</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023260954A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>van der Veen, Gijs</creatorcontrib><creatorcontrib>Houben, Patrick</creatorcontrib><creatorcontrib>Stokkermans, Joep</creatorcontrib><creatorcontrib>Wesselingh, Jasper</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>van der Veen, Gijs</au><au>Houben, Patrick</au><au>Stokkermans, Joep</au><au>Wesselingh, Jasper</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CURVED WAFER STAGE</title><date>2023-08-17</date><risdate>2023</risdate><abstract>The disclosure relates to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target and to a wafer stage to be used in such an apparatus. The wafer chuck includes a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows an improved throughput of the wafer stage. The film frame carrier used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent so that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and prevents or limits the ring-shaped body to be bent so that the shape of the mounting surface becomes more convex than the first shape.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2023260954A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title CURVED WAFER STAGE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T14%3A34%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=van%20der%20Veen,%20Gijs&rft.date=2023-08-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023260954A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true