PRINTED CIRCUIT BOARD MESH ROUTING TO REDUCE SOLDER BALL JOINT FAILURE DURING REFLOW

Voids are introduced in a copper shape to reduce warpage experienced by a printed circuit board during a reflow process. Copper shapes on an outer layer of a printed circuit board may be used to connect large packages that include ball grid arrays to the printed circuit board. The copper shapes may...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU, Juan-Yi, RODRIGUEZ, Benito Joseph, DASH, Dillip Kumar, YANG, Po Chun, CHANG, Shu-Ming
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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