WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lin...

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Hauptverfasser: KAWAGUCHI, Shuji, TAKE, Seiji, HATSUTA, Chiaki
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
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creator KAWAGUCHI, Shuji
TAKE, Seiji
HATSUTA, Chiaki
description A wiring board (10) includes a substrate (11) and a mesh wiring layer (20) disposed on the substrate (11) and including a plurality of wiring lines (21, 22). The substrate (11) has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines (21, 22) includes a metal layer (27) and a blackened layer (28) disposed on the metal layer (27). The blackened layer (28) has a thickness (T2) of 5 nm or more and 100 nm or less.
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subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
title WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
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