UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN FOR INTEGRATED FAN-OUT PACKAGE WITH INTEGRATED PASSIVE DEVICE

A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a firs...

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Hauptverfasser:	Tseng, Ying-Cheng, Yu, Chen-Hua, Huang, Yu-Chih, Kuo, Ting-Ting, Liu, Chiahung, Lai, Chi-Hui, Tai, Chih-Hsuan, Wang, Chuei-Tang, Wu, Ban-Li, Tsai, Hao-Yi, Liu, Chung-Shi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	Tseng, Ying-Cheng Yu, Chen-Hua Huang, Yu-Chih Kuo, Ting-Ting Liu, Chiahung Lai, Chi-Hui Tai, Chih-Hsuan Wang, Chuei-Tang Wu, Ban-Li Tsai, Hao-Yi Liu, Chung-Shi
description	A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN FOR INTEGRATED FAN-OUT PACKAGE WITH INTEGRATED PASSIVE DEVICE
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