TRANSCEIVER AND INTERFACE FOR IC PACKAGE
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cab...
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| creator | VICICH, Brian R GUETIG, Keith R VERDIELL, Jean-Marc A MUSSER, Randall E MONGOLD, John A ZBINDEN, Eric J |
| description | An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023251441A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023251441A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023251441A13</originalsourceid><addsrcrecordid>eNrjZNAICXL0C3Z29QxzDVJw9HNR8PQLcQ1yc3R2VXDzD1LwdFYIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxkamhiYmho6GxsSpAgB1qySc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><source>esp@cenet</source><creator>VICICH, Brian R ; GUETIG, Keith R ; VERDIELL, Jean-Marc A ; MUSSER, Randall E ; MONGOLD, John A ; ZBINDEN, Eric J</creator><creatorcontrib>VICICH, Brian R ; GUETIG, Keith R ; VERDIELL, Jean-Marc A ; MUSSER, Randall E ; MONGOLD, John A ; ZBINDEN, Eric J</creatorcontrib><description>An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS ; TRANSMISSION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230810&DB=EPODOC&CC=US&NR=2023251441A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230810&DB=EPODOC&CC=US&NR=2023251441A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VICICH, Brian R</creatorcontrib><creatorcontrib>GUETIG, Keith R</creatorcontrib><creatorcontrib>VERDIELL, Jean-Marc A</creatorcontrib><creatorcontrib>MUSSER, Randall E</creatorcontrib><creatorcontrib>MONGOLD, John A</creatorcontrib><creatorcontrib>ZBINDEN, Eric J</creatorcontrib><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><description>An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSMISSION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAICXL0C3Z29QxzDVJw9HNR8PQLcQ1yc3R2VXDzD1LwdFYIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxkamhiYmho6GxsSpAgB1qySc</recordid><startdate>20230810</startdate><enddate>20230810</enddate><creator>VICICH, Brian R</creator><creator>GUETIG, Keith R</creator><creator>VERDIELL, Jean-Marc A</creator><creator>MUSSER, Randall E</creator><creator>MONGOLD, John A</creator><creator>ZBINDEN, Eric J</creator><scope>EVB</scope></search><sort><creationdate>20230810</creationdate><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><author>VICICH, Brian R ; GUETIG, Keith R ; VERDIELL, Jean-Marc A ; MUSSER, Randall E ; MONGOLD, John A ; ZBINDEN, Eric J</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023251441A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSMISSION</topic><toplevel>online_resources</toplevel><creatorcontrib>VICICH, Brian R</creatorcontrib><creatorcontrib>GUETIG, Keith R</creatorcontrib><creatorcontrib>VERDIELL, Jean-Marc A</creatorcontrib><creatorcontrib>MUSSER, Randall E</creatorcontrib><creatorcontrib>MONGOLD, John A</creatorcontrib><creatorcontrib>ZBINDEN, Eric J</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VICICH, Brian R</au><au>GUETIG, Keith R</au><au>VERDIELL, Jean-Marc A</au><au>MUSSER, Randall E</au><au>MONGOLD, John A</au><au>ZBINDEN, Eric J</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TRANSCEIVER AND INTERFACE FOR IC PACKAGE</title><date>2023-08-10</date><risdate>2023</risdate><abstract>An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS TRANSMISSION |
| title | TRANSCEIVER AND INTERFACE FOR IC PACKAGE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T00%3A03%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=VICICH,%20Brian%20R&rft.date=2023-08-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023251441A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |